Product Introduction

Electroplating process is widely been used in electronic manufacturing process. In PCB or semiconductor, the copper interconnect is very important in building the designed circuit pattern. During the process, the PCB or wafer is placed as cathode, and metal will grow according to the desired pattern by electrodeposition. Accordingly, anode is necessary material to proceed the reaction.

Conventionally, in PCB or decorative plating industry, the batch-type electroplating machine was widely employed, and it normally equipped with the soluble phosphorous-doped Cu anode. However, as the miniature of copper interconnect and chasing for higher output, the continuous electroplating machine becomes the mainstream product in the industry. The continuous plating machine can be furthered divided into the horizontal type or vertical type machine. For better plating performance, the mixed-metal-oxide (MMO) based titanium insoluble anode gradually replaces the conventional soluble Cu anode, and the iridium/tantalum-based coating DSA is the most extensively employed type for oxygen evolution reaction.

Owing its outstanding advantage, DSA has extensively been employed in the functional via-filling, through-hole filling, periodic-pulse reverse (PPR) copper electroplating process. Furthermore, to satisfy the unique and miniature via-filling process, copper sulfate electrolyte bath should be added with specialized organic additives to control the selective growth of Cu within the favorable region. However, since the organic additive normally contains thiol (-SH) functional group, it can easily be oxidized and degraded during the electroplating process.

Based on the advantage of DSA, DeNora develop unique MMO coating with the aim to control the organic additive consumption rate during the advanced via-filling process. Since 2002, based on the durable iridium oxide type coating, DeNora develop the first generation DT1 DSA, which can meet the demand for low additive consumption rate and long service life, and further launch the DT3 type DSA for better performance in 2006. Until now, the fifth generation DT5 anode already possesses very low organic additive consumption rate as the soluble phosphorus-doped Cu anode. We solve the intrinsic high oxidizing activity of DSA, and still keep the advantages of long service life and low maintenance burden, offering the best solution of via-filling process for PCB industry.

We represents DeNora company’s DT series DSA, and our product already has evidence in matching with various brands of organic additive supplier in PCB via-filling production such as JCU, MacDermid, DOW chemical, Schlotter, Atotech…etc. The DT series DSA has proven to successfully reduce the consumption rate of organic additives, and ameliorates the accumulation rate of inactive by-product, which effectively prolong the lifetime of copper sulfate bath.

We offer professional titanium manufacturing service for DSA, and is able to meet the demand for most electroplating equipment such as PAL, Atotech, Almex, AEL…etc. Based on the equipment’s design, we are able to offer highly customized titanium frame, hook, or conductive bar. Moreover, we offer various electrolytic bag or membrane for anode equipment, and provides comprehensive customized design based on customer’s demand.

Product advantages

• High discharging stability and uniformity
• Long service life
• Low organic additive consumption rate
• No need for consistent maintenance
• Excellent corrosion resistivity
• Complete service for titanium manufacturing